AMD携手韩国政府设立AI研究中心，构建异构AI计算开放生态7月28日，据韩联社报道，韩国科学技术信息通信部与AMD签署关于AI芯片生态系统合作的谅解备忘录，双方将在韩国设立AI研究中心（称为"AI卓越中心"），旨在打造开放式AI基础设施生态系统。双方计划…

On July 28, according to Yonhap News Agency, South Korea’s Ministry of Science and ICT signed a memorandum of understanding with AMD on cooperation in the AI chip ecosystem. The two sides will establish an AI research center in South Korea, known as the “AI Center of Excellence,” with the aim of building an open AI infrastructure ecosystem. The two sides plan to develop heterogeneous AI computing infrastructure by connecting AMD’s CPUs and GPUs with AI chips, or NPUs, from South Korean companies that have strengths in inference. The cooperation will cover areas including memory, networking, servers, and software. The center will provide support for South Korean companies, universities, and research institutions in areas such as technical cooperation, AI chip software development, computing technology validation, and joint research. It will also promote collaboration with local South Korean AI chip companies.

据半导体行业20日消息，三星电子、SK海力士和美光已同时停止自主研发CXL（ComputeExpressLink）控制器，此前它们曾大力投资研发这一下一代半导体技术。美光率先终止了专有控制器研发项目，转而采用PrimeMars的方案；SK海力士近日正式通知主要合作伙伴将停止自研，相关研发人员重新分配至内存内处理（PIM）领域；三星电子仅将自研控制器用于内部研发团队研究，商业化项目已排除在外，对外销售产品则采购无晶圆厂公司的控制器。三家厂商最初计划销售集成自研控制器和DRAM的“集成CXL模块”高价成品，但大型数据中心客户为节省基础设施建设成本，更倾向“分离式”架构——将CXL控制器单独连接到系统主板，插入通用DRAM内存条。此举源于对“自我蚕食”的担忧：强行推广高价一体化产品可能削弱通用DRAM（DIMM）这一核心收入来源的需求。这一市场空白将由Montage、AsteraLabs和PrimeMars等无晶圆厂公司填补。

According to semiconductor industry reports on the 20th, Samsung Electronics, SK Hynix and Micron have all stopped developing their own CXL (Compute Express Link) controllers, despite previously making major investments in this next-generation semiconductor technology. Micron was the first to terminate its proprietary controller development project and has shifted to PrimeMars’ solution. SK Hynix recently formally notified key partners that it would stop in-house development, with relevant R&D personnel reassigned to the processing-in-memory (PIM) field. Samsung Electronics will use its self-developed controllers only for internal R&D, while excluding them from commercial projects. For products sold externally, the company will instead procure controllers from fabless companies. The three manufacturers had originally planned to sell high-priced finished “integrated CXL modules” that combine self-developed controllers with DRAM. However, large data center customers, seeking to reduce infrastructure construction costs, prefer a “disaggregated” architecture: connecting CXL controllers separately to system motherboards while using standard DRAM DIMMs. The shift is driven by concerns over “self-cannibalization.” Forcing the adoption of expensive integrated products could weaken demand for standard DRAM DIMMs, which remain a core revenue source for memory manufacturers. The market gap created by this shift is expected to be filled by fabless companies such as Montage Technology, Astera Labs and PrimeMars.

7月14日，联电宣布其位于新加坡的12英寸硅光子产线已开始批量生产先进光子芯片，满足AI数据中心对高速互连日益增长的需求。联电高级副总经理洪圭钧表示，硅光子和CPO技术将成为公司未来数年的重要增长动力。将光子芯片生产从传统8英寸晶圆转向12英寸，可有效降低光学损耗，提升功率效率与传输性能。新加坡本土光子芯片企业Silith Technology成为该产线首位核心战略客户，其客户包括光模块厂商中际旭创和Coherent，两家公司均为英伟达和谷歌的重要供应商。联电还与比利时微电子研究中心IMEC共同建设光子芯片生产平台，计划2027年起向更多客户开放。封装配套层面，联电规划2027年推出定制化先进封装业务，将光子芯片连接至中介层以缩短电气传输路径。长期规划上，联电计划2028年推出开放式硅光子开发平台，并同步开展薄膜铌酸锂芯粒技术研发。中国台湾、新加坡将共同作为联电光子芯片和先进封装业务的主要研发及制造基地，现阶段已组建百人专业技术团队。

On July 14, United Microelectronics Corporation (UMC) announced that its 12-inch silicon photonics production line in Singapore has begun volume production of advanced photonic chips, addressing growing demand for high-speed interconnects in AI data centers. UMC Senior Vice President Steven H. K. Hong said silicon photonics and CPO technologies will become important growth drivers for the company over the next several years. Shifting photonic chip production from traditional 8-inch wafers to 12-inch wafers can effectively reduce optical loss while improving power efficiency and transmission performance. Singapore-based photonic chip company Silith Technology has become the first core strategic customer of the production line. Its customers include optical module maker Zhongji Innolight and Coherent, both of which are major suppliers to Nvidia and Google. UMC is also jointly building a photonic chip production platform with Belgium-based microelectronics research center imec, with plans to open the platform to more customers starting in 2027. On the packaging side, UMC plans to launch customized advanced packaging services in 2027, connecting photonic chips to interposers to shorten electrical transmission paths. In its long-term roadmap, UMC plans to launch an open silicon photonics development platform in 2028 while also carrying out R&D on thin-film lithium niobate chiplet technology. China’s Taiwan region and Singapore will jointly serve as UMC’s main R&D and manufacturing bases for photonic chips and advanced packaging. The company has already assembled a specialized technical team of around 100 people.