Market Trend（May 6）Flip chip ushers in bright futureIn the field of high-speed and high-performance packaging design, the most frequently used packaging solution is flip chip-in package (FCiP) technology. As we all know, FCiP technology has many adv…

01 市场动态（5月6日）倒装芯片，大有可为在高速高性能封装设计领域，最常用的封装解决方案是倒装芯片封装（FCiP）技术。众所周知，倒装芯片比传统引线键合封装具有多种优势，例如卓越的热性能和电气性能、高 I/O 能力、满足不同性能要求的基板灵活性、完善的工艺设备专业…

Company Trend(April 24)SK hynix invested heavily to build DRAM factory, overweighting AI chip marketRecently, SK hynix, the giant of chip supplier, announced to invest 20 trillion won (about US$ 14.6bn) to build a brand-new memory chip manufacturing f…

企业动态（4月24日）SK海力士斥巨资建DRAM工厂，加码AI芯片市场近日，韩国芯片巨头SK海力士公司宣布，将投资20万亿韩元（约合146亿美元）在忠清北道原计划的NAND工厂用地上，建设一座全新的存储芯片制造工厂——M15X工厂。此举旨在巩固其在高性能存储芯片市场的领导地位，…

Company Trend(April 15)Samsung takes the lead to mass-produce 290-layer V-NAND flash memoryIn the wave of continuous innovation in the semiconductor industry, Samsung is standing at the forefront of technology again. According to the reports of South …

企业动态（4月15日）三星即将引领闪存技术新潮流，量产290层V-NAND闪存在半导体行业持续创新的浪潮中，三星电子再次站在了技术前沿。据韩国媒体报道，三星计划最早于4月开始量产业界领先的290层第九代V-NAND（3D NAND）闪存芯片，这一技术突破标志着三星在闪存堆叠层数方…